What is MCP?
MCP (Multi-Chip Package) combines two or more memory types (e.g., NAND + DRAM, LPDDR + NOR) into a single compact package. It’s ideal for space-limited applications like smartphones, wearables, and handheld systems.
UMT is one of Asia’s leading providers of advanced MCP solutions.
Benefits of UMT’s MCP Chips
1. Space-Saving Integration
Instead of mounting separate chips, UMT’s MCP packages everything into one – reducing footprint and simplifying design.
2. Lower Power and Noise
With shorter interconnects, MCPs reduce energy loss and improve data transfer speeds.
3. Cost Efficiency for OEMs
Fewer components, fewer soldering steps, and easier QA lead to lower production costs.
4. High Compatibility
UMT MCPs are available in various capacities and support widely used SoCs and platforms.
Conclusion
UMT MCP is the perfect solution when you need high performance in limited space.
Let Pionix Vietnam help you streamline your next-gen embedded designs with powerful memory integration.