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GSD04GHFB4-E3N3C0 | GSTO DDR3 4GB 1600 MT/s DRAM Module
GSD04GHFB4-E3N3C0 – GSTO DDR3 4 GB 1600 MT/s DRAM module (x8 organization, 1.5 V, CL11 latency, industrial-grade reliability, 30 µ gold plating, –40 °C to +85 °C)
Key Features
- JEDEC-compliant DDR3 SDRAM, 4 GB capacity
- Data rate: 1600 MT/s (DDR3-1600)
- Organization: 512M × 8 × 8 banks (x8)
- CAS latency: 11-11-11
- Voltage: 1.5 V ±0.075 V
- 30 µ” gold-plated contacts for enhanced durability
- Operating temperature: –40 °C to +85 °C (industrial grade)
- RoHS & Halogen-free compliant
- 78-ball FBGA package (9 × 13 mm)
Technical Specifications
| Specification | Details |
|---|---|
| Capacity | 4 GB |
| Memory Type | DDR3 SDRAM |
| Data Rate | 1600 MT/s |
| Organization | 512M × 8 × 8 banks |
| CAS Latency | 11-11-11 |
| Voltage | 1.5 V ±0.075 V |
| Package | 78-ball FBGA (9 × 13 mm) |
| Operating Temperature | –40 °C to +85 °C |
| Gold Plating | 30 µ” |
| RoHS / Halogen-Free | Yes |
Benefits
- Industrial-grade reliability: Wide-temp support and robust signal integrity
- Compact footprint: FBGA package ideal for embedded boards
- Long-term availability: Designed for longevity in industrial supply chains
- JEDEC-compliant: Ensures compatibility across platforms
- Enhanced durability: 30 µ” gold plating resists corrosion and wear
Why Choose GSTO?
GSTO’s GSD04GHFB4-E3N3C0 is engineered for embedded and industrial systems requiring stable, long-life DDR3 memory. With wide-temperature support and JEDEC compliance, it’s ideal for automation, networking, and rugged computing platforms.
Smartphone
Automotive
AI & IoT Devices
Networking Equipment
Industrial PC
Embedded Systems
Smart TV / Media Player
Server / Memory Module
Consumer Electronics
Storage Devices
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