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Datasheet
MCP
MCP is a combination of SLC Nand Flash and LPDDR.It reduces the chip size and the interference of the external circuit.Improves the overall system performance and reliability. Widely used in mobile phones, tablets,Data card, communication module, AIoT.
Product parameters
Density
Bus Width
Type
Speed
Page Size
Package
Protocol
Grade
Status
1+1/2+1/ 2+2/4+2
SLC Nand X8, LPDDR X32
SLC Nand flash
LPDDR 400M/533M
8.0X10.5
FBGA 162
Industrial
MP
Datasheet
Product Recommendation
SPI NAND provides fewer pins and smaller package size, which saves design and PCB costs of the system. The device has an internal ECC to save the workload of the Chipsets. It supports 1.8V/3.3V voltages, and the product comes in WSON packaging.
The product complies with JEDEC standard and can be widely used on the ONFI 1.0 protocol. OOB Size can support 1,2,4,6,8bit ECC of Chipsets. It can be widely used in various applications such as network communication, set-top boxes, smart speakers.