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GSE16GAAE3-F5V5C0 – GSTO eMMC5.1 16 GB HS400 flash (310 MB/s read, 200 MB/s write, LDPC ECC, wear leveling, –25 °C to +85 °C operation)

Key Features

  • Compliant with JEDEC e.MMC 5.1, backward-compatible with v4.5–v5.1
  • HS400 interface: up to 310 MB/s read, 200 MB/s write
  • Random IOPS: up to 3,600 read / 2,500 write
  • Bus widths supported: 1-, 4-, 8-bit SDR & DDR at 200 MHz
  • On-die LDPC ECC, wear leveling, and bad-block management
  • Dual boot partitions (4 MB each) and Replay Protected Memory Block (RPMB)
  • Secure erase, sanitize, trim, and discard supported
  • Supply voltages: VCC 2.7–3.6 V, VCCQ 1.7–1.95 V or 2.7–3.6 V
  • Operating temperature: –25 °C to +85 °C

Technical Specifications

Specification Details
Capacity 16 GB
Interface e.MMC 5.1 HS400, SDR/DDR up to 200 MHz
Max Sequential Read / Write 310 MB/s / 200 MB/s
Random IOPS (Read / Write) 3,600 / 2,500
Package 153-ball FBGA, 11.5 × 13 × 1.0 mm
Supply Voltages VCC 2.7–3.6 V; VCCQ 1.7–1.95 V or 2.7–3.6 V
Active Current (Read / Write) 85 mA / 80 mA
Standby Current (Auto-Sleep) 10 µA (VCC) / 75 µA (VCCQ)
Sleep Current 0 µA (VCC off) / 75 µA (VCCQ)
Operating Temperature –25 °C … +85 °C
Pre-Burned Capacity 4.85 GB
Boot Partitions 2 × 4 MB
User Data Area 14,912 MB

Benefits

  • Simplified integration: Embedded flash controller reduces host CPU load
  • Reliable performance: Industrial-grade ECC and dynamic wear leveling
  • Enhanced security: Boot partitioning, RPMB, secure erase and password protection
  • Low power design: Auto-sleep and sleep mode for optimized standby power
  • Space-efficient: Ultra-thin BGA package—only 1.0 mm thick

Why Choose GSTO?

GSTO’s GSE16GAAE3-F5V5C0 is engineered for compact, high-speed embedded designs in mobile, consumer and smart devices. With robust firmware and industrial-grade control, it delivers consistent performance and durability across its lifecycle.

See other eMMC5.1 products from GSTO

Smartphone
Automotive
AI & IoT Devices
Networking Equipment
Industrial PC
Embedded Systems
Smart TV / Media Player
Server / Memory Module
Consumer Electronics
Storage Devices

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