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SPI NAND Flash
SPI NAND provides fewer pins and smaller package size, which saves design and PCB costs of the system. The device has an internal ECC to save the workload of the Chipsets. It supports 1.8V/3.3V voltages, and the product comes in WSON packaging.
Product parameters
Density
Bus Width
Type
Speed
Page Size
Package
Protocol
Grade
Status
2Gb/1Gb
x1/x2/x4
SPI Nandflash
108
8X6
WSON8X6
SPI
Industrial
MP
Product Recommendation
The product complies with JEDEC standard and can be widely used on the ONFI 1.0 protocol. OOB Size can support 1,2,4,6,8bit ECC of Chipsets. It can be widely used in various applications such as network communication, set-top boxes, smart speakers.
