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eMMC
Product parameters
Density
Bus Width
Type
Speed
Page Size
Package
Protocol
Grade
Status
4Gb/256Gb
153 FBGA
Commercial
MP
Product Recommendation
SPI NAND provides fewer pins and smaller package size, which saves design and PCB costs of the system. The device has an internal ECC to save the workload of the Chipsets. It supports 1.8V/3.3V voltages, and the product comes in WSON packaging.